In thermal design, the lowest material specification is not always sufficient as a selection criterion. In applications with larger tolerances, limited clamping force, or thermal cycling, greases or pastes can be prone to pump-out, migration, and variable bond line thickness. Dispensable gap fillers reduce this risk but introduce additional process steps and dispensing control.
A solid thermal pad offers a reproducible interface with predictable thermal resistance in such cases, without added process complexity.
Parker Chomerics therefore introduces THERM-A-GAP PAD 10: an extremely compliant and soft gap filler with a hardness of 35 Shore 00 and excellent thermal conductivity of 1.0 W/m·K. The material effectively absorbs height variations and minimizes contact resistance without applying high mechanical stress to PCBs, solder joints, or power modules. Thanks to its fixed thickness and mechanical stability, the thermal interface remains consistent, even under vibration and thermal cycling, ensuring reliable heat transfer throughout the product’s lifetime.
Key Features:
- Hardness: 35 Shore 00
- Thermal conductivity: 1.0 W/m·K
- Low required clamping force
- High surface conformity
- UL 94 V-0 rating
THERM-A-GAP PAD 10 is available in standard sheet sizes, various thicknesses, and as die-cut or custom configurations for series production integration.
