Designing 5G hardware introduces new EMI/RFI challenges, particularly with the introduction of the 60 GHz frequency. At short range, many mmWave signals are present, tolerances are tighter, and system integration is more complex. Interference issues often occur at enclosure seams, connector interfaces, and inadequate grounding between PCBs and chassis.
Traditional late-stage EMI solutions are not sufficiently scalable for 5G applications and can result in inconsistent performance in production.
LeaderTech supports design teams with a broad portfolio of solutions:
- PCB shields for sensitive modules
- Fabric-over-foam and metal EMI gaskets for reliable shielding around panels and I/O interfaces
- Conductive elastomers for enclosure seals
- Honeycomb vent panels that combine airflow with high shielding effectiveness
Effective EMI/RFI shielding requires an integrated approach from the early electronics and mechanical design stages. Key considerations include continuous grounding paths, controlled compression of EMI gaskets, and the prevention of unintended leak paths during assembly or thermal stress. Ventilation openings pose a risk if airflow is not combined with adequate shielding.
By integrating EMI/RFI measures early in the design process, developers can improve the performance, reproducibility, and time-to-market of 5G systems.
