The material is made from the conductive non-woven Shieldex Zeven+30, which provides shielding performance of up to 90 dB on average across the frequency range of 300 MHz to 10 GHz. Dimensions can be customized to protect a variety of equipment, from defense components such as torpedoes, drones, smart sensors, measurement instruments, to other sensitive electronic systems.

Seams are constructed with silver-plated Shieldex thread and finished with Shieldex Ultraflex tape, ensuring a durable and leak-free shield. An optional triple-fold closure with double-layer electrically conductive hook-and-loop fastener allows for quick and secure sealing without compromising EMI protection.

With extensive experience in EMC solutions for defense and industrial applications, including RF tents, pouches, and shielding materials, Shieldex offers products that preserve the electromagnetic integrity of equipment during transport, loading, storage, or testing scenarios. The Faraday Bag is an example of a flexible, reliable solution providing interference protection regardless of the type of sensitive electronic component.

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The optimized distribution of conductive fibers ensures stable electrical resistance over many closure cycles. In addition, permanent compression is very low (<5 %), meaning the material retains its original thickness after prolonged pressure or multiple assembly cycles, maintaining consistent sealing and conductivity. Typical electrical resistance is <40 mΩ at 30 % compression, and shielding effectiveness is 95 dB from 20 MHz to 10 GHz.

SOFT-SHIELD 4860 can be supplied with or without conductive adhesive backing and is available in rolls, sheets, strip gaskets, or custom die-cut shapes. The material is UL 94 V-0 tested, halogen-free, nickel-free, and compliant with RoHS and REACH.

Typical applications include I/O panels, backplanes, connectors, access panels, telecom racks, servers, desktop PCs, and large LCD/PDP displays.

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The material is made from a lightweight, inorganic, non-combustible ceramic foam with a conical cell structure. The internal surfaces are coated with a dielectric-loaded layer. The combination of geometric tapering and material properties provides a gradual impedance transition, minimal surface reflection, and efficient dissipation of electromagnetic energy into heat.

ABS-FGA offers broadband impedance matching over the frequency range of 2 to 18 GHz. The material can operate at power densities up to 2.5 W/cm² while maintaining its mechanical and electromagnetic properties up to 125 °C.

The absorber blocks are modular and easy to integrate into absorbing walls or radar and RF test setups, where thermal stability and reproducible measurement conditions are critical.

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Traditional late-stage EMI solutions are not sufficiently scalable for 5G applications and can result in inconsistent performance in production.

LeaderTech supports design teams with a broad portfolio of solutions:

• PCB shields for sensitive modules
• Fabric-over-foam and metal EMI gaskets for reliable shielding around panels and I/O interfaces
• Conductive elastomers for enclosure seals
• Honeycomb vent panels that combine airflow with high shielding effectiveness

Effective EMI/RFI shielding requires an integrated approach from the early electronics and mechanical design stages. Key considerations include continuous grounding paths, controlled compression of EMI gaskets, and the prevention of unintended leak paths during assembly or thermal stress. Ventilation openings pose a risk if airflow is not combined with adequate shielding.

By integrating EMI/RFI measures early in the design process, developers can improve the performance, reproducibility, and time-to-market of 5G systems.

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Each H-Field antenna consists of a ferrite rod with a coil wound around it and a corresponding unit (AK-HFR). The ferrite material concentrates the magnetic component of the RF signal into the coil, giving a physically small antenna a significantly larger effective area. The sensitivity is also much higher than that of a coil without ferrite, as used in traditional loop antennas.

The set covers the full measurement range from 100 Hz to 30 MHz and is suitable for MIL-STD, VDE, and TEMPEST testing, where reliable and repeatable measurements are crucial. A battery-powered preamplifier extends functionality and is compatible with all H-Field antennas.

The antenna kit includes:

• Case
• EHA-50B Amplifier, 100 Hz – 30 MHz
• Rod Antenna 100 Hz – 100 kHz
• Rod Antenna 20 kHz – 2 MHz
• Rod Antenna 1 MHz – 10 MHz
• Rod Antenna 5 MHz – 30 MHz
• 3 m BNC(M) to N(M) cable

All antennas are individually calibrated; calibration data and certificate are included. The set comes with a three-year warranty.

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A solid thermal pad offers a reproducible interface with predictable thermal resistance in such cases, without added process complexity.

Parker Chomerics therefore introduces THERM-A-GAP PAD 10: an extremely compliant and soft gap filler with a hardness of 35 Shore 00 and excellent thermal conductivity of 1.0 W/m·K. The material effectively absorbs height variations and minimizes contact resistance without applying high mechanical stress to PCBs, solder joints, or power modules. Thanks to its fixed thickness and mechanical stability, the thermal interface remains consistent, even under vibration and thermal cycling, ensuring reliable heat transfer throughout the product’s lifetime.

Key Features:

• Hardness: 35 Shore 00
• Thermal conductivity: 1.0 W/m·K
• Low required clamping force
• High surface conformity
• UL 94 V-0 rating

THERM-A-GAP PAD 10 is available in standard sheet sizes, various thicknesses, and as die-cut or custom configurations for series production integration.

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The amount of noise absorbed at higher frequencies depends on the resistive component of the permeability (μ’). Depending on the material type and thickness, effective damping can be achieved from below 1 MHz up into the GHz range.

Key Specifications:

• Material: NiZn soft ferrite
• Frequency range: < 1 MHz up to GHz range
• Available thicknesses: 0.13 – 0.53 mm
• Multiple material variants (six types)
• PET backing with self-adhesive layer
• Operating temperature: –40 °C to +85 °C
• Typical thermal resistance: 6 W/m °C
• Available in standard sheets of 60×60 mm and 120×120 mm or custom-cut

Typical applications include suppressing radiated emissions, optimizing RFID and NFC antennas, wireless charging systems, and reducing interference around PCBs, ICs, and switching power supplies.

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Thermal greases fill small air gaps and maintain perfect contact between components and heatsinks, even on surfaces that are not completely flat. With minimal bond lines starting from 0.025 mm and a soft pressure load, no stress is placed on PCBs, solder joints, or sensitive components. The low thermal impedance, starting from 0.065 °C cm²/W depending on the type, ensures efficient heat transfer, tested according to the ASTM D5470 standard.

Compared to hard pads or phase-change materials, greases are ideal for repeated maintenance or when tolerances vary. The pastes are easy to apply via stenciling, screen printing, or dispensing, require no curing, and perform reliably under thermal cycling, high humidity, and long-term temperature stress, supported by extensive durability testing.

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The innovation lies in the composition: passivated, silver-plated aluminum particles in a fluorosilicone binder. This makes the gasket not only effective against electromagnetic interference but also resistant to aggressive chemicals and corrosion on aluminum. Thanks to its low durometer, the CHO-SEAL 1299 can be used in sensitive interfaces where traditional gaskets require excessive force during assembly, potentially damaging enclosures or components.

The CHO-SEAL 1299 is available in pre-formed molded shapes such as O-rings and customer-specific designs, as well as sheet material suitable for precision die-cutting or cutting with a knife or water jet. An optional electrically conductive PSA adhesive layer is also available, enabling simple and reliable installation.

This unique combination of softness, shielding, and durability makes the CHO-SEAL 1299 ideal for portable electronics, military communication modules, UAVs such as drones, robotics, and marine electronics. Wherever compactness, reliability, and corrosion resistance are required, this product provides a dependable and distinctive solution.

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The operation is straightforward: the blanket is placed over a test setup or component, blocking external and internal interference signals. This allows RF signals to be isolated and measurement results to remain reliable. This is critical for EMC testing or measurements in chambers where electronics, antennas, or complete antenna systems are being evaluated.

The Shieldex RF Shielding Blanket is made from advanced Shieldex textile and can be used in a variety of environments—from R&D labs to production validation. For technicians, it provides a practical way to reduce interference sources directly without major modifications to the test setup.

The blankets are available in standard sizes ranging from 1.2 × 1.2 m to 4.8 × 4.8 m, with custom configurations available for specialized applications.

With its combination of high shielding performance and flexibility, the Shieldex RF Shielding Blanket is a valuable addition to any EMC engineer’s toolkit, supporting accurate and reproducible measurements.

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