Parker Chomerics is supplies of form-in-place (FIP) EMC gaskets in addition to fixed EMC seals.
The compound material is mainly applied by robotic dispensers from kit cartridges to obtain required accuracies in height, thickness and position.
Chomerics CHOFORM FIP compound is available in many different versions, both one and two components, curing in the oven or by moisture in the air.
The filling material in the compound can be composed of silver, aluminum, copper, nickel and graphite mixtures, which determines the EMC attenuation level.
The correct FIP compound is selected on the basis of several criteria:
– EMC attenuation degrees
– hardness and compressibility of the final seal
– degree of adhesion to the substrate
– resistance to galvanic corrosion
– desired width / height of the seal
EEMC has a computer-controlled robot dispenser that can place the most accurate EMC seals.
The field of application is often complex shapes in high-tech equipment for industry, automotive, defense and aerospace.