Electronic components are becoming more powerful and compact, increasing the demands on thermal management. Thermal gap fillers provide a reliable solution: they bridge air gaps and surface irregularities between heat sources and heat sinks, significantly improving thermal conductivity without requiring high mechanical pressure.

The new THERM-A-GAP PAD 80 from Parker Chomerics is a high-performance gap filler that combines thermal conductivity with low compression force and high conformability. This makes the material suitable for a wide range of applications, from 5G and telecom equipment to automotive electronics, LED modules, and high-performance systems such as servers.

Key properties:

• Thermal conductivity: 8.3 W/m·K
• Low compression force, ideal for fragile components
• Electrically insulating
• UL 94 V-0 flammability rating
• Operating temperature range: -55 °C to +200 °C
• Meets NASA outgassing requirements

PAD 80 is available in standard thicknesses from 0.76 to 5.1 mm and can be supplied in sheets or custom-cut parts. Various carriers are available, including PEN film, fiberglass, aluminum foil, and an optional pressure-sensitive adhesive (PSA) layer for added adhesion and easier assembly.

With this combination of ease of use and reliable performance, the material helps extend the service life of electronic systems.