For engineers seeking an efficient and reliable low-pressure thermal interface, Leader Tech offers an innovative approach with the TCI series. These thin, silver-colored foils are made of a special indium composite that becomes fluid at 80 °C, allowing it to perfectly conform to surface irregularities between components and heat sinks. At room temperature, the material returns to a solid state, ensuring stability and reusability.
With high thermal conductivity in all directions and extremely low thermal resistance, this material is well-suited for applications with high power density, such as high-performance CPUs/GPUs/APUs on graphics cards, embedded systems, and telecom equipment.
Specifications:
- Thermal conductivity: ≥ 80 W/m·K in all directions
- Thermal resistance: ≤ 0.004 °C·cm²/W at 3.5 bar
- Operating temperature: –50 °C to +500 °C
- Thickness: 0.2 and 0.5 mm
- Size: 150 × 150 mm
- Density: 7.3 g/cm³
- Electrical resistivity: 8.4 × 10⁻⁸ Ω·m
The TCI series is an effective option for OEMs and developers who need to manage thermal issues without applying pressure or mechanical stress to their components. EEMC can die-cut the sheet material into custom shapes according to customer specifications.
