In high-tech electronics such as quantum computing, defense, automotive, medical, and semiconductor industries, efficient heat dissipation is essential to ensure component reliability and longevity. Thermal interface materials (TIMs) form the connection between the heat source and the heat sink. A proven solution is Therm-a-Gap Gel from Parker Chomerics. This soft, thermally conductive gel fills all…
DetailsFor EMC engineers working with CS101 (MIL-STD-461G) or DO-160 testing, Schlöder offers a practical and complete solution: the MGA CT B-50/100 coupling transformer with integrated differential amplifier. This system clearly differs from conventional coupling transformers, which often require external setups to monitor the injected voltage. With the built-in amplifier, the measured differential voltage is easily…
DetailsEMC springs, or fingerstocks, are used in enclosures, shielded housings, and on printed circuit boards as ESD contacts and EMI gaskets. For edge mounting, it is essential to consider clip size, mounting retention, deflection parameters, and finger configuration. Leader Tech now introduces the Reverse Bend fingerstock gasket, an advanced development of the traditional EMC spring.…
DetailsElectronic components are becoming more powerful and compact, increasing the demands on thermal management. Thermal gap fillers provide a reliable solution: they bridge air gaps and surface irregularities between heat sources and heat sinks, significantly improving thermal conductivity without requiring high mechanical pressure. The new THERM-A-GAP PAD 80 from Parker Chomerics is a high-performance gap…
DetailsFor engineers seeking an efficient and reliable low-pressure thermal interface, Leader Tech offers an innovative approach with the TCI series. These thin, silver-colored foils are made of a special indium composite that becomes fluid at 80 °C, allowing it to perfectly conform to surface irregularities between components and heat sinks. At room temperature, the material…
DetailsFor engineers working in the VLF to HF range, AH Systems offers a practical solution: the SAS-564 passive loop antenna. This compact and durable antenna covers frequencies from 1 kHz to 30 MHz, making it suitable for a wide range of test and measurement applications, including Direction Finding (DF). The antenna’s design enables highly directional…
DetailsEMC spring contacts or fingerstock are originally made of copper-beryllium (CuBe2) due to its unique combination of high electrical conductivity, excellent spring properties, and mechanical strength. This made it the gold standard for EMI/RFI shielding in demanding applications such as aerospace, defense, and telecommunications. However, copper-beryllium can be toxic during processing and may pose health…
DetailsThe new series of Oval-Snap-It and Oval-Clip-It ferrite cores from Fair-Rite offer several advantages over the conventional round variants. The oval geometry is an ideal solution for common-mode chokes, where two cables can be routed side by side to suppress the generated interference signals from motor drives, power supplies, and other applications. This oval design…
DetailsIn high-tech electronics such as aerospace, defense, telecommunications, and the semiconductor industry, a reliable EMC seal is essential. Parker Chomerics is a global leader in the development of thermal interface and electrically conductive compounds, including high-quality Form-in-Place (FIP) seals or gaskets. These so-called seals or beads are often applied automatically using a robot dispenser, with…
DetailsMagnetic field shielding is critical for the reliable operation of quantum computers. Traditionally, mu-metal is used for this purpose, but this material is not suitable for the extremely low temperatures in which quantum computers operate. Magnetic Shields has developed Cryophy: a special soft magnetic nickel-iron alloy that provides optimal magnetic shielding in cryogenic environments at…
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