In high-tech electronics such as aerospace, defense, telecommunications, and the semiconductor industry, a reliable EMC seal is essential. Parker Chomerics is a global leader in the development of thermal interface and electrically conductive compounds, including high-quality Form-in-Place (FIP) seals or gaskets.
These so-called seals or beads are often applied automatically using a robot dispenser, with widths ranging from 0.46mm to 1.57mm. Chomerics offers the CHO-FORM product series, an electrically conductive FIP material known for its consistently high quality and reliability, making it prescribed for many high-tech applications.
There are several selection criteria:
- EMC shielding properties
- Corrosion resistance (including galvanic)
- Temperature resistance
- Hardness / resilience in the cured state
- Shear force or adhesive force on the substrate
- Degree of outgassing
- Space available for the gasket (width)
- Cost
This may result in a base material made from one or two components that are cured in an oven or at an ambient temperature, with or without a silicone base as the carrier.
EEMC is an expert factory distributor and can provide advice on both the choice of material and the physical application of the FIP gasket, complete with measurement data and, if necessary, the packaging of the finished product.
