In high-tech electronics such as quantum computing, defense, automotive, medical, and semiconductor industries, efficient heat dissipation is essential to ensure component reliability and longevity. Thermal interface materials (TIMs) form the connection between the heat source and the heat sink.
A proven solution is Therm-a-Gap Gel from Parker Chomerics. This soft, thermally conductive gel fills all microscopic surface irregularities and ensures effective heat transfer under low pressure. Thanks to its thixotropic properties, the material does not flow during application, maintaining a stable dot shape.
Precise dispensing is performed with a robotic dispenser that places TIM dots at the required locations. The robot continuously measures the substrate height and automatically adjusts the needle position so that each dot has consistent shape and volume. This results in a reproducible process and optimal thermal contact—critical for chips that make direct contact with a heat sink on their top surface.
Key benefits of Therm-a-Gap:
- High thermal conductivity under low pressure
- Low outgassing and high reliability
- Thixotropic behavior: dots remain in place
- Flexible integration into automated production
The combination of advanced dispensing robotics and high-quality materials such as Therm-a-Gap Gel provides a stable, efficient, and scalable solution for thermal management in modern electronics. EEMC supports material selection and the dispensing process, including validation, measurement reports, and packaging solutions to protect finished products.
