Chomerics introduces a new generation of thermal greases for efficient heat dissipation in electronic applications. The THERM-A-GREASE series consists of four silicone-based variants with thermal conductivities of 1.5, 3.0, 5.0, and 7.0 W/m·K, ensuring a suitable solution for a wide range of thermal challenges in power electronics, computing, and automotive modules.

Thermal greases fill small air gaps and maintain perfect contact between components and heatsinks, even on surfaces that are not completely flat. With minimal bond lines starting from 0.025 mm and a soft pressure load, no stress is placed on PCBs, solder joints, or sensitive components. The low thermal impedance, starting from 0.065 °C cm²/W depending on the type, ensures efficient heat transfer, tested according to the ASTM D5470 standard.

Compared to hard pads or phase-change materials, greases are ideal for repeated maintenance or when tolerances vary. The pastes are easy to apply via stenciling, screen printing, or dispensing, require no curing, and perform reliably under thermal cycling, high humidity, and long-term temperature stress, supported by extensive durability testing.