Naturally, having all these technologies at our disposal, the construction of a complete vacuum enclosure is no problem either. The enclosure is being constructed according to your design, optionally with integrated hermetically sealed connectors.
It is also possible to apply “thermally conductive via’s” thanks to extensive knowledge and experience in conjoining (non-similar) metals from our partners. Titanium will serve as the enclosure’s base material and cylindrical aluminum shaped via’s will be placed at strategic locations. These areas will maintain their thermal expansion coefficient of only 8.5 [ppm/°C] while the via’s increase the thermal conductivity up to 220 [W/mK].